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IEEE® 802.11 b/g/n Link Controller Module with Integrated Bluetooth® 5.0
Introduction
Features
1 Ordering Information and Module Marking
2 Block Diagram
3 Pinout and Package Information
3.1 Package Description
4 Electrical Characteristics
4.1 Absolute Maximum Ratings
4.2 Recommended Operating Conditions
4.3 DC Characteristics
4.4 IEEE 802.11 b/g/n Radio Performance
4.5 Bluetooth Radio Performance
4.6 Timing Characteristics
5 Power Management
5.1 Device States
5.2 Controlling Device States
5.3 Power-Up/Down Sequence
5.4 Digital I/O Pin Behavior During Power-Up Sequences
6 Clocking
6.1 Low-Power Clock
7 CPU and Memory Subsystem
7.1 Processor
7.2 Memory Subsystem
7.3 Nonvolatile Memory (eFuse)
8 WLAN Subsystem
8.1 MAC
8.2 PHY
8.3 Radio
9 Bluetooth® Subsystem
9.1 Bluetooth® 5.0 Features
9.2 Features
10 External Interfaces
10.1 Interfacing with the Host Microcontroller
10.2 SDIO Client Interface
10.3 SPI Client Interface
10.4 I2C Client Interface
10.5 UART Interface
10.6 GPIOs
10.7 Internal Pull-Up Resistors
11 Application Reference Design
11.1 Host Interface - SPI
11.2 Host Interface - SDIO
12 Package Outline Drawings
13 Design Considerations
13.1 Module Placement and Routing Guidelines
13.2 Antenna Performance of ATWILC3000-MR110CA
13.3 ATWILC3000-MR110UA Placement and Routing Guidelines
13.4 Approved Antenna Types
13.5 Reflow Profile Information
13.6 Module Assembly Considerations
13.7 Conformal Coating
14 Appendix A: Regulatory Approval
14.1 United States
14.2 Canada
14.3 Europe
14.4 Japan
14.5 Korea
14.6 Taiwan
14.7 China
14.8 Other Regulatory Information
15 Reference Documentation
16 Document Revision History
Microchip Information
Trademarks
Legal Notice
Microchip Devices Code Protection Feature

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