Updated to Microchip template. Microchip DS20006341 replaces Atmel document 8869. Corrected tLOW typo from 400 ns to 500 ns. Corrected tAA typo from 550 ns to 450 ns. Updated Package Marking Information. Updated Product ID System. Updated the “Software Reset” section. Added ESD rating. Removed lead finish designation. Updated trace code format in package markings. Updated formatting throughout for clarification. Added a figure for “System Configuration Using 2‑Wire Serial EEPROMs”. Added POR recommendations section. Updated formatting to current template. Updated the SOIC, TSSOP, UDFN and SOT23 package drawings to Microchip format.
Added the UDFN Expanded Quantity Option and the bulk SOIC and TSSOP ordering codes. Updated ordering code table, 8X and 8MA2 package drawings, the ordering information section and the disclaimer page. Corrected pinouts from bottom to top view and reorganization figures. No changes to functional specification.
Updated data sheet status from preliminary to complete and disclaimer page. Added AC measurement conditions note to the AC Characteristics table. Updated the Random Read and Serial Number Read figures.
Initial document release.