Contents

Introduction Features 1. Quick Reference Info 1.1. Reference Documentation 1.2. Acronyms and Abbreviations Used 2. Network Architecture 2.1. End-Device Architecture 2.2. LoRaWAN Device Types 2.2.1. Battery Powered - Class A (All Devices) 2.2.2. Low Latency - Class B (Beacon) 2.2.3. No Latency - Class C (Continuous) 2.3. End-device Activation (Joining) 2.3.1. Over-The-Air Activation 2.3.2. Activation By Personalization (ABP) 2.4. LoRaWAN Layers 3. Package Overview 3.1. LoRaWAN Stack Directory Structure 4. Architecture 5. Example Demo Project 5.1. Building the Firmware 5.2. Flashing the Firmware 5.3. Application Configuration 5.4. Stack Attributes 5.4.1. Regional Configuration Parameters 5.5. Demo Application Usage 6. Supporting MAC Layers 6.1. Regional Configurations 6.1.1. Dynamic Regional Configuration Support in Application 6.2. Power Management Module 6.2.1. Using PMM in Application 6.3. Persistent Data Server 6.3.1. PDS Module Overview 6.3.2. PDS Module Sub-Layers 6.3.2.1. NVM Sub-Layer 6.3.2.2. Wear Leveling Sub-layer 6.3.2.3. Files and Items Sub-layer 6.3.2.4. Task Handler 6.3.3. PDS Configuration 6.3.4. Using PDS in the Application 6.4. Software Timer 6.5. Bootloader 6.5.1. Bootloader PC Tool Usage 7. Document Revision History The Microchip Website Product Change Notification Service Customer Support Microchip Devices Code Protection Feature Legal Notice Trademarks Quality Management System Worldwide Sales and Service