The bypass capacitors (47 μF and 22 μF)
must be placed near, or at the edge of the device.
All decoupling capacitors (0.1 μF and 0.01
μF) must be 0402 or of a smaller package size as they are required to be mounted on the
reverse side of the board. They must fit between the adjacent vias of the BGA package pins.
These decoupling capacitors are selected to have a low impedance over the operating
frequency and temperature range.
The capacitor pad to via trace must be small. Figure 1 shows how these capacitors are mounted. The capacitors can also be mounted directly on
the pad on the vias.