Component Placement

• The bypass capacitors (47 μF and 22 μF) must be placed near, or if possible, at the edge of the device.
• All decoupling capacitors (0.1 μF and 0.01 μF) must be 0402 or of a smaller package size as they are required to be mounted under BGA package. They must be fit between the adjacent vias of BGA package pins. These decoupling capacitors are selected to have a low impedance over operating frequency and temperature range.

The capacitor pad to via trace must be small. Figure 1 shows how these capacitors are mounted. The capacitors can also be mounted directly on the pad on the vias. The decoupling capacitors must not be shared via connections.