The bypass capacitors (47 μF and 22 μF)
must be placed near, or at the edge of the device.
All decoupling capacitors (0.1 μF and 0.01
μF) must be 0402 or of a smaller package size as they are needed to be mounted on the
reverse side of the board. They must be fit between the adjacent vias of BGA package pins.
These decoupling capacitors are carefully selected to have low impedance over the operating
frequency and temperature range.
The capacitor pad to via trace must be small. Figure 1 shows how these capacitors are mounted. The capacitor can also be
mounted directly on the pad on the vias.