The BM83 module can be soldered to the host board using standard leaded and lead-free solder reflow profiles. The BM83 module is assembled using a standard lead-free reflow profile, IPC/JEDEC J-STD-020.
To avoid the damage to the module, it is mandatory to follow the recommendations as listed:
- Refer to AN233 Solder Reflow Recommendation Application Note for the soldering reflow recommendations.
- Do not exceed peak temperature (TP) of +260ºC.
- Use no-clean flux solder paste.
- Do not wash the module as moisture can be trapped under the shield.
- Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.
The following figure illustrates the reflow profile of the BM83 module.
Figure 1. Reflow Profile
