Thermal Characteristics

Table 1.
Standard Operating Conditions (unless otherwise stated)
Param No. Sym. Characteristic Typ. Units Conditions
TH01 θJA Thermal Resistance Junction to Ambient 95.3 °C/W 14-pin SOIC package
100 °C/W 14-pin TSSOP package
62.2 °C/W 20-pin PDIP package
77.7 °C/W 20-pin SOIC package
87.3 °C/W 20-pin SSOP package
79.7 °C/W 20-pin VQFN package
TH02 TJMAX Maximum Junction Temperature 150 °C  
Note:
  1. 1.See “Absolute Maximum Ratings” for total power dissipation.