Absolute Maximum Ratings(†)

Parameter Rating
Ambient temperature under bias -40°C to +125°C
Storage temperature -65°C to +150°C
Voltage on pins with respect to VSS
  • on VDD pin:
  -0.3V to +6.5V
  • on VDDIO2 pin:
with I3C Disabled -0.3V to +6.5V
with I3C Enabled -0.3V to +3.63V
  • on VDDIO3 pin:
with I3C Disabled -0.3V to +6.5V
with I3C Enabled -0.3V to +3.63V
  • on MCLR pin:
  -0.3V to +9.0V
  • on all other pins:
  -0.3V to (VDD + 0.3V)
Maximum current(1)
  • on VSS pin
-40°C ≤ TA ≤ +85°C 350 mA
85°C < TA ≤ +125°C 120 mA
  • on VDD pin (14-pin devices)
-40°C ≤ TA ≤ +85°C 140 mA
85°C < TA ≤ +125°C 50 mA
  • on VDD pin (20-pin devices)
-40°C ≤ TA ≤ +85°C 190 mA
85°C < TA ≤ +125°C 65 mA
  • on VDDIO2 pin
-40°C ≤ TA ≤ +85°C  
85°C < TA ≤ +125°C  
  • on VDDIO3 pin
-40°C ≤ TA ≤ +85°C  
85°C < TA ≤ +125°C  
  • on any standard I/O pin
  ±50 mA
Clamp current, IK (VPIN < 0 or VPIN > VDD) ±20 mA
Total power dissipation(2) 800 mW
  1. 1.Maximum current rating requires even load distribution across I/O pins. Maximum current rating may be limited by the device package power dissipation characterizations, see the Thermal Characteristics section to calculate device specifications.
  2. 2.Power dissipation is calculated as follows:

    PDIS = VDD x {IDD - Σ IOH} + Σ {(VDD - VOH) x IOH} + Σ (VOI x IOL).

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for extended periods may affect device reliability.