Absolute Maximum Ratings(†)

Parameter		Rating
Ambient temperature under bias		-40°C to +125°C
Storage temperature		-65°C to +150°C
Voltage on pins with respect to V_SS
on V_DD pin:		-0.3V to +6.5V
on V_DDIO2 pin:	with I3C Disabled	-0.3V to +6.5V
on V_DDIO2 pin:	with I3C Enabled	-0.3V to +3.63V
on V_DDIO3 pin:	with I3C Disabled	-0.3V to +6.5V
on V_DDIO3 pin:	with I3C Enabled	-0.3V to +3.63V
on MCLR pin:		-0.3V to +9.0V
on all other pins:		-0.3V to (V_DD + 0.3V)
Maximum current⁽¹⁾
on V_SS pin	-40°C ≤ T_A ≤ +85°C	350 mA
on V_SS pin	85°C < T_A ≤ +125°C	120 mA
on V_DD pin (14-pin devices)	-40°C ≤ T_A ≤ +85°C	140 mA
on V_DD pin (14-pin devices)	85°C < T_A ≤ +125°C	50 mA
on V_DD pin (20-pin devices)	-40°C ≤ T_A ≤ +85°C	190 mA
on V_DD pin (20-pin devices)	85°C < T_A ≤ +125°C	65 mA
on V_DDIO2 pin	-40°C ≤ T_A ≤ +85°C
on V_DDIO2 pin	85°C < T_A ≤ +125°C
on V_DDIO3 pin	-40°C ≤ T_A ≤ +85°C
on V_DDIO3 pin	85°C < T_A ≤ +125°C
on any standard I/O pin		±50 mA
Clamp current, I_K (V_PIN < 0 or V_PIN > V_DD)		±20 mA
Total power dissipation⁽²⁾		800 mW

Notes:

1.Maximum current rating requires even load distribution across I/O pins. Maximum current rating may be limited by the device package power dissipation characterizations, see the Thermal Characteristics section to calculate device specifications.
2.Power dissipation is calculated as follows:
P_DIS = V_DD x {I_DD - Σ I_OH} + Σ {(V_DD - V_OH) x I_OH} + Σ (V_OI x I_OL).

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for extended periods may affect device reliability.