Thermal Characteristics

Table 1.
Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +125°C

Param No. Sym. Characteristic Typ. Units Conditions
TH01 θJA Thermal Resistance Junction to Ambient °C/W 8-pin SOIC package
°C/W 8-pin DFN package
°C/W 14-pin SOIC package
°C/W 14-pin TSSOP package
°C/W 16-pin VQFN 3x3mm package
°C/W 20-pin PDIP package
°C/W 20-pin SSOP package
°C/W 20-pin SOIC package
°C/W 20-pin VQFN 3x3mm package
TH03 TJMAX Maximum Junction Temperature 150 °C  
TH04 PD Power Dissipation W PD = PINTERNAL+PI/O
TH05 PINTERNAL Internal Power Dissipation W PINTERNAL = IDD x VDD(1)
TH06 PI/O I/O Power Dissipation W PI/O = Σ(IOL*VOL)+Σ(IOH*(VDD-VOH))
TH07 PDER Derated Power W PDER = PDMAX (TJ-TA)/θJA(2)
Notes:
  1. 1.IDD is current to run the chip alone without driving any load on the output pins.
  2. 2.TA = Ambient Temperature, TJ = Junction Temperature.