Microchip Back Matter Variables

This file should include all the variables used in the Back Matter. If you replace the image below, please remember to add back the varid=PIS_IMAGE.

PIS_IMAGE

Empty PIS_NOTES variable below

Empty PIS_TABLE variable below

PIS_EXAMPLES

Examples
Table 1. AT28C010 Ordering Information
Ordering Code Standard Military Drawing Number (SMD#) Package Number tACC(ns) Operating Range
AT28C010-12DM/883 5962-38267 07 MXA 32D6 120 Military/883C Class B, Fully Compliant (-55°C to 125°C)
AT28C010-12EM/883 5962-38267 07 MUA 32L1
AT28C010-12FM/883 5962-38267 07 MZA 32F
AT28C010-12UM/883 5962-38267 07 MTA 30U
AT28C010-15DM/883 5962-38267 05 MXA 32D6 150
AT28C010-15EM/883 5962-38267 05 MUA 32L1
AT28C010-15FM/883 5962-38267 05 MZA 32F
AT28C010-15UM/883 5962-38267 05 MTA 30U
AT28C010-20DM/883 5962-38267 03 MXA 32D6 200
AT28C010-20EM/883 5962-38267 03 MUA 32L1
AT28C010-20FM/883 5962-38267 03 MZA 32F
AT28C010-20UM/883 5962-38267 03 MTA 30U
AT28C010-12DM/883 5962-38267 01 MXA 32D6 250
AT28C010-12FM/883 5962-38267 01 MZA 32F
AT28C010-WM None Die Sales Note 1
AT28C010-DWFM None Wafer Sales Note 1
Note:
  1. 1.Contact Microchip Sales for Die and Wafer sales
Table 2. AT28C010E Ordering Information
Ordering Code Standard Military Drawing Number (SMD#) Package Number tACC(ns) Operating Range
AT28C010E-12DM/883 None 32D6 120 Military/883C Class B, Fully Compliant (-55°C to 125°C)
AT28C010E-12EM/883 None 32L1
AT28C010E-12FM/883 None 32F
AT28C010E-12UM/883 None 30U
AT28C010E-15DM/883 None 32D6 150
Package Types
32D6 32-Lead, 0.600" Wide, Non-Windowed, Ceramic Dual Inline (Cerdip)
32F 32-Lead, Non-Windowed, Ceramic Bottom-Brazed Flat Package (Flatpack)
32L1 32-Pad, Non-Windowed, Combo Lid, Leadless Chip Carrier (LCC)
30U 30-Pin, Ceramic Pin Grid Array (PGA)
WM Diced Die Military
DWFM Die in Wafer Form Military
Options
Blank Standard Device: Endurance = 10K Write Cycles; Write Time 10 ms
E High Endurance Option: Endurance = 100K Write Cycles

ISBN_VAR: 978-1-5224-2232-7