| θJA |
Thermal Resistance Junction to Ambient
(Thermal simulation, no airflow) |
58 |
°C/W |
14-pin SOIC package (SL) |
| 44 |
°C/W |
20-pin SOIC package (SO) |
| 79.7 |
°C/W |
20-pin VQFP package (REB) |
Notes:
- 1.Power dissipation is calculated as
follows:
PDIS = VDD ×
{IDD - Σ IOH} + Σ
{(VDD - VOH) × IOH}
+ Σ (VOI × IOL)
- 2.Internal Power Dissipation is calculated as follows:
PINTERNAL = IDD × VDD,
where IDD is current to run the chip alone
without driving any load on the output pins.
- 3.Derated Power is calculated as follows: PDER =
PDMAX
(TJ-TA)/θJA, where
TA = Ambient Temperature, TJ =
Junction Temperature.
|