Absolute Maximum Ratings

Stresses beyond those listed in this section can cause permanent damage to the device. This is a stress rating only. Functional operation of the device at these, or other conditions beyond those indicated in the operational sections of this specification, is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Table 1. Absolute Maximum Ratings
Parameter Condition Rating Units
Ambient temperature under bias   -40 to +125 °C
Maximum jonction temperature   145 °C
Storage temperature   -65 to +150 °C
Voltage on pins with respect to GND
On the VDD pin   -0.3 to +6.5 V
On the VDDIO2 pin   -0.3 to +6.5 V
On the RESET pin   -0.3 to + 9.0) V
On the MVIO pins   -0.3 to (VDDIO2 + 0.3) V
On all other pins   -0.3 to (VDD + 0.3) V
Maximum current
On the GND pin(1) -40°C ≤ TA ≤ +85°C 350 mA
+85°C < TA ≤ +125°C 120 mA
On the VDD pin(1) -40°C ≤ TA ≤ +85°C 350 mA
+85°C < TA ≤ +125°C 120 mA
On the VDDIO2 pin(1) -40°C ≤ TA ≤ +85°C 350 mA
+85°C < TA ≤ +125°C 120 mA
On any standard I/O pin   ±50 mA
Clamp current, IK (VPIN < 0 or VPIN > VDD)   ±20 mA
Total power dissipation(2)   800 mW
Note:
  1. 1.The maximum current rating requires even load distribution across I/O pins. The maximum current rating may be limited by the device package power dissipation characterizations. See Thermal Characteristics to calculate device specifications.
  2. 2.Power dissipation calculates as follows: PDIS = VDD × {IDD - Σ IOH} + Σ {(VDD - VOH) × IOH} + Σ (VOI × IOL)