Features
- IEEE® 802.11 b/g/n 20 MHz (1x1)
solution
- Single spatial stream in 2.4 GHz ISM
band
- Integrated
Transmit/Receive switch
- Integrated PCB antenna or
U.FL
micro co-ax connector for external antenna
- Superior sensitivity and range via
advanced PHY signal processing
- Advanced equalization and channel
estimation
- Advanced carrier and timing
synchronization
- Wi-Fi® Direct (supported till firmware
release 19.5.2)
- Soft-AP support
- Supports IEEE 802.11 WEP, WPA, WPA2
security
- Support Enterprise security with
WPA/WPA2 (802.1X)(1)
- EAP-TLS
- EAP-PEAPv0/1 with TLS
- EAP-TTLSv0 with MSCHAPv2
- EAP-PEAPv0/1 with MSCHAPv2
- Superior MAC throughput via hardware
accelerated two-level A-MSDU/A-MPDU frame aggregation and block acknowledgment
- On-chip memory management engine to
reduce host load
- SPI host interface
- Operating temperature range from -40°C
to +85°C. RF performance at room temperature of 25oC with a 2-3
dB change at boundary conditions
- Power
supply for I/O (VDDIO) rages from 2.7V to 3.6V
- Power supply for DC/DC
converter
(VBAT) ranges from 3.0V to 4.2V
- Built-in 26 MHz crystal
- Integrated Flash memory for system
software
- Power Save modes
- 4 µA Power-Down mode typical at
3.3V I/O
- 380 µA Doze mode with chip
settings preserved (used for beacon monitoring)
(2)
- On-chip low power sleep
oscillator
- Fast host wake-up from Doze mode
by a pin or SPI transaction
- Fast Boot options
- On-chip boot ROM (Firmware instant
boot)
- SPI flash boot
- Low-leakage on-chip memory for
state variables
- Fast AP re-association (150
ms)
- On-chip Network stack to offload MCU
- Network features TCP, UDP, DHCP,
ARP, HTTP,
TLS and
DNS
- Hardware accelerators for Wi-Fi
and TLS security to improve connection time
- Hardware accelerator for IP
checksum
- Hardware accelerators for OTA
security
- Small footprint host driver
- Wi-Fi Alliance® certifications for
Connectivity and Optimizations