Document Revision History

Note: The data sheet revision is independent of the die revision (Revision bit in the Device Identification register of the Device Service Unit, DSU.DID.REVISION) and the device variant (last letter of the ordering number).

Revision	Date	Section	Changes
E	06/2021	Document	Replaced Master/Slave with the new terminologies. For more details, see the following note.
		Europe	Updated European Compliance table.
		Ordering Information and Module Marking	Updated Figure 1 with Tray and Tape and Reel packing information.
D	10/2020	ATWINC15x0-MR210PB Placement and Routing Guidelines	Updated Figure 1 Figure 2
		Nonvolatile Memory (eFuse)	Updated the contents.
		Interfacing with the Host Microcontroller	Updated Figure 1 Table 1
		Application Schematic	Updated Figure 1
		ATWINC15x0-MR210UB Placement and Routing Guidelines	Updated
		Reference Documentation	Updated Table 1
		Block Diagram	Updated Figure 1
		Pin Description	Updated Figure 1
		WLAN Subsystem	Added footnotes for Short GI feature
		Transmitter Performance	Updated Table 1 Added notes
		External Interfaces	Added lead sentence Updated the list Updated Figure 1 Updated Table 1
		GPIO Pins	Added Notes
		Current Consumption in Various Device States	Updated Table 1
		Recommended External Antenna for ATWINC15x0-MR210UB	Added
		Regulatory Approval	Added Gain Table for Individual Regulatory Region section Updated United States, Canada and Europe with the details of antennas used for approval Revamped Europe section Added expiry date information in China Added regulatory note for Brazil (ANATEL) in Brazil
		Reference Documentation	Updated Table 1
C	09/2018	Features	Added Enterprise security feature and related note.
		Ordering Information and Module Marking	Updated Table 1.
		Pin Description	Updated Table 1.
		SPI Timing	Added note for Table 1.
		Schematic Design Information	Editorial updates.
		Module Assembly Considerations	Editorial updates.
		Reflow Profile Information	Removed Solder Paste. Removed Stencil Design. Editorial updates.
		Regulatory Approvals	Updated the content of certifications to include the details of ATWINC1510-MR210UB module.
B	12/2017	Introduction	Editorial updates.
		Features	Editorial updates.
		Regulatory Approvals	Revised the content of certifications.
		Reference Documents	Updated Table 15-1.
A	02/2017	Document	Change of document style. Change the name to incorporate all the ATWINC15x0-MR210xB module family. New Microchip document number. Previous version was Atmel document 42502 rev. B.
		Product Description	Added description information indicating that the document content is relevant to all WINC1500 Module models unless noted. Changed SSL references to TLS. Removed WAPI security. Removed UART as host interface. Editorial updates.
		Product Features	Removed WAPI security. Removed UART and I²C as host interfaces. Removed Bluetooth coexistance interface. Replaced SSL with TLS. Added 26 MHz crystal. Removed: (4KB flash – less than 1KB RAM).
		Order Information and Module Marking	Revised Ordering table. Revised Marking information. Figure.
		Block Diagram	Revised Block Diagram figure.
		Pin Description	Revised Pin Description drawing. Editorial updates.
		Electrical Specifications	Revised VDDIO maximum voltage in table 4.1 and added max temperatures. Revised table 4-2 to include Recommended operating temperature.
		CPU and Memory Subsystems	Editorial update.
		WLAN Subsystem RADIO	Added text regarding performance derating at cold temperature. Features table revisions and changes: Corrected the package height Revised Storage temperature Added performance test conditions to the performance tables. Revised the Receive performance in table 6-2. Revised the 802.11b mode Transmit performance numbers in table 6-3. Revised Transmit performance Footnotes. Changed max frequency to 2.472GHz. Editorial updates.
		External Interfaces	Revised SPI timing information in table 7-3. Removed Bluetooth Coexistance section. Removed SDIO. Editorial updates.
		Power Consumption	Added Module Reset section for reset duration. Editorial updates.
		ATWINC15x0-MR210PB Placement and Routing Guidelines	Added text for antenna types used in test and an associated table. Revised Co-Ax connector type.
		Schematic Design Information	Removed SDIO schematic. Editorial updates.
		Module Drawings	Updated module drawing figures and figure titles. Added section with footprint drawing.
		Design Considerations	Added sections for Module design and assembly considerations and module PCB placement.
		Reflow Profile Information	Revised reflow profile picture to be clearer. Editorial updates.
		Certification Notices	Added section for Agency Certification notices (now under Regulatory Approvals with Rev. B).
		Agency Regulatory Approvals	Added back Agency Approval section. Revised content of certifications.
		Reference Documents	Moved Design File Package to a separate paragraph below the table to remove web availability aspect and to contact sales.

Note: Microchip is aware that some terminologies used in the technical documents and existing software codes of this product are outdated and unsuitable. This document may use these new terminologies, which may or may not reflect on the source codes, software GUIs and the documents referenced within this document. The following table shows the relevant terminology changes made in this document.

Table 1. Terminology Related Changes
Old Terminology	New Terminology	Description
Master	Host	The following sections are updated with new terminology: Pin Description SPI Timing Characteristics Interfacing with the Host Microcontroller SPI Client Interface Overview SPI Timing
Slave	Client

(Atmel) Rev B - 02/2016

Document	Updated copyright date to 2016. Updated footers.
Module Outline Drawing	Revised Module outline drawings to show Ground pad to be soldered. Pulled out Footprint drawing as this is covered in the Module drawing.
WLAN Subsystem Radio	Revised Transmit Performance Table 6-3.
Power Consumption	Revised current table references in Table 8-1.
Schematic Design Information	Updated Schematics Section 11 text and figures Figure 11-1 and Figure 11-2.
Reflow Profile Information	Revised section 12 Reflow Profile Information.
Reference Documents	Updated Document Reference table to include the ATWINC1500-MU datasheet.

(Atmel) Rev A - 07/2015

Document	Updated due to changes in the ATWINC1500 from Rev A to Rev B.
Description	Updated model revisions to rev B. Corrected Package dimensions.
Features	Added Hardware Accelerator content to features list.
Pinout Information	Updated reference schematic. New pin list adds GPIO's 3,4,5 and 6.
CPU and Memory Subsystems	Increased Memory from 182KB to 160KB.
External Interfaces	Improved and corrected description of Coexistence interface. Editorial updates.
Power Consumption	Updated power numbers and description, added high-power and low-power modes.
WLAN Subsystem Radio	Updated Performance numbers.