This section provides the package dimension details of the WLR089U0 module.
Note: For the most recent package drawings, see the Microchip
Packaging Specification located at http://www.microchip.com/packaging.
Figure 1. WLR089U0 Module Package Outline Drawings
- 1.The module pins are arranged with a 1 mm pitch distance. The module is designed symmetrically.
Figure 2. WLR089U0 Module Package Outline Drawings – Contd.,
