Thermal Characteristics

Table 1.
Standard Operating Conditions (unless otherwise stated)
Param No. Sym. Characteristic Typ. Units Conditions
TH01 θJA Thermal Resistance Junction to Ambient 60 °C/W 28-pin SPDIP package
80 °C/W 28-pin SOIC package
90 °C/W 28-pin SSOP package
27.5 °C/W 28-pin QFN 6x6mm package
47.2 °C/W 40-pin PDIP package
TBD °C/W 40-pin UQFN 5x5 package
46 °C/W 44-pin TQFP package
24.4 °C/W 44-pin QFN 8x8mm package
TH02 θJC Thermal Resistance Junction to Case 31.4 °C/W 28-pin SPDIP package
24 °C/W 28-pin SOIC package
24 °C/W 28-pin SSOP package
24 °C/W 28-pin QFN 6x6mm package
24.7 °C/W 40-pin PDIP package
TBD °C/W 40-pin UQFN 5x5 package
14.5 °C/W 44-pin TQFP package
20 °C/W 44-pin QFN 8x8mm package
TH03 TJMAX Maximum Junction Temperature 150 °C  
TH04 PD Power Dissipation W PD=PINTERNAL+PI/O(3)
TH05 PINTERNAL Internal Power Dissipation W PINTERNAL=IDDxVDD(1)
TH06 PI/O I/O Power Dissipation W PI/O=Σ(IOL*VOL)+Σ(IOH*(VDD-VOH))
TH07 PDER Derated Power W PDER=PDMAX (TJ-TA)/θJA(2)
  1. 1.IDD is current to run the chip alone without driving any load on the output pins.
  2. 2.TA = Ambient Temperature, TJ = Junction Temperature.
  3. 3.See "Absolute Maximum Ratings" for total power dissipation.