Contents
Introduction
Features
Applications
4. Reference Documents
5. Description
6. Block Diagram
7. Pinout
7.1. Pinout Overview
7.2. Pin List
7.2.1. PIOA Pin List
7.2.2. PIOB Pin List
7.2.3. PIOC Pin List
7.2.4. PIOD Pin List
7.2.5. System Pin List
7.2.6. Power Pin List
8. Power Considerations
8.1. Power Supplies
8.2. Power-Up/Down Considerations
8.3. Power Management Unit
8.4. Power Configurations
9. MPU and Memory Subsystem
9.1. SAM9X60 System-In-Package (SIP)
9.2. MPU Clocks
9.3. NAND Flash Memory
10. LAN Subsystem
10.1. EEPROM
10.2. Ethernet Clock
10.3. Ethernet PHY
10.4. Interfacing with the Ethernet PHY
10.4.1. Ethernet Design Schematic Example
10.4.2. Ethernet Design Layout Recommendations
10.4.3. Ethernet Design Layout Example
11. External Interfacing
11.1. Interfacing with FLEXCOM Interfaces
11.1.1. Interfacing in I²C Mode
11.1.2. Interfacing in UART Mode
11.1.3. Interfacing in SPI Mode
11.2. Interfacing with an SD Card
11.2.1. Design Schematic Example
11.2.2. Design Layout Recommendations
11.3. Interfacing with an LCD
11.3.1. Design Schematic Example
11.3.2. Design Layout Recommendations
11.4. Interfacing with Class D Audio Output
11.5. Interfacing with a Wireless Module
11.5.1. Design Schematic Example
11.5.2. Design Layout Recommendations
11.6. Interfacing with an Image Sensor
11.6.1. Design Schematic Example
11.6.2. Design Layout Recommendations
11.7. Interfacing with a QSPI Memory
11.7.1. Design Schematic Example
11.7.2. Design Layout Recommendations
12. Electrical Characteristics
12.1. Absolute Maximum Ratings
12.2. Recommended Operating Conditions
12.3. DC Characteristics
12.4. Power Consumption
13. Mechanical Characteristics
13.1. SAM9X60D1G-I/LZB Dimensions
13.2. SAM9X60D1G-I/LZB Land Pattern (Host Board PCB Footprint)
13.3. Other Characteristics
14. Assembly and Storage Information
14.1. Storage Conditions
14.1.1. Moisture Barrier Bag Before Opening
14.1.2. Moisture Barrier Bag Open
14.2. Motherboard Solder Paste
14.3. Motherboard Stencil Design
14.4. Bake Information
14.5. Reflow Profile
15. Ordering Information
16. Revision History
16.1. DS60001747A - 01/2022
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