55.3 Power Supply
DC CHARACTERISTICS | Standard
Operating Conditions: VDD = AVDD = 1.71V to 3.63V (unless otherwise
stated) Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial Temperature |
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Param. No. | Symbol | Characteristics | Min. | Typ. | Max. | Units | Conditions |
REG_1 | VDDCORE_CIN (1) | VDDCORE Input Bypass parallel Capacitor pair | 3.76 | 4.7 | — | µF | Bulk Ceramic or solid Tantalum with ESR
<0.5Ω. Min and max represent absolute values including cap tolerances |
80 | 100 | — | nF | Ceramic XR7 with ESR <0.5Ω | |||
REG_5 | VDD_CIN (1) | VDD Input Bypass parallel Capacitor pair | 8 | 10 | — | µF | Bulk Ceramic or solid Tantalum with ESR
<0.5Ω Separate BULK capacitor for each VDD |
80 | 100 | — | nF | Ceramic XR7 with ESR <0.5Ω on all VDD pins | |||
REG_9 | VREFx_CIN (1) | External VREFx Input Bypass parallel Capacitor pair | 8 | 10 | — | µF | Bulk Ceramic or solid Tantalum with ESR <0.5Ω |
80 | 100 | — | nF | Ceramic XR7 with ESR <0.5Ω | |||
REG_13 | VBAT_CIN (1) | VBAT Input Bypass parallel Capacitor pair | 8 | 10 | — | µF | Bulk Ceramic or solid Tantalum with ESR <0.5Ω |
80 | 100 | — | nF | Ceramic XR7 with ESR <0.5Ω | |||
REG_17 | AVDD_CIN (1) | AVDD Input Bypass parallel Capacitor pair | 8 | 10 | — | µF | Bulk Ceramic or solid Tantalum with ESR <0.5Ω |
80 | 100 | — | nF | Ceramic XR7 with ESR <0.5Ω | |||
REG_23 | AVDD_LEXT (2) | AVDD series Ferrite Bead DCR (DC Resistance) | — | — | 0.1 | Ω | ≥600Ω @ 100 MHz |
REG_25 | Ferrite Bead current Rating | 500 | — | — | mA | — | |
REG_27 | VSW_LEXT (3,4,5) | Buck Switch Mode Regulator Inductor
Inductance (If LDO Mode not used) |
— | 10 | — | µH | Shielded Inductor ONLY (If used in BUCK mode else No Connect) |
REG_29 | Inductor DCR (DC Resistance) | — | — | 0.36 | Ω | — | |
REG_31 | Inductor ISAT Rating | 500 | — | — | mA | — | |
REG_33 | BUCK_PEFF | Buck Mode Power Efficiency | — | 66 | — | % | IOUT = 100 uA |
REG_35 | — | 74 | — | % | IOUT = 100 mA | ||
REG_36 | VDDCORE | VDDCORE Voltage Range | — | 1.2 | — | V | CPU Active, cache and
prefetch disabled, executing "while(1)" from Flash |
REG_37 | VDD | VDD Input Voltage Range | 1.71 | 3.3 | 3.63 | V | BOD33 Disabled |
REG_37A | IDDVDD_MAX | VDD/AVVD Max Current | — | — | 130 | mA | I/O pins configured as inputs |
REG_39 | AVDD | AVDD Input Voltage Range | 1.71 | 3.3 | 3.63 | V | BOD33 Disabled |
REG_41 | VBAT | VBAT Input Voltage Range | 1.71 | — | 3.63 | V | BOD33 Disabled |
REG_41A | IDDVBAT_MAX | VBAT Max Current | — | — | 315 | µA | OSCULP32K, BOD and RTC enabled |
REG_43 | SVDD_R | VDD, AVDD Rise Ramp Rate to Ensure Internal Power-on Reset Signal |
0.2 | — | 100 | mV/µs | Failure to meet this specification may lead to start-up or unexpected behaviors |
REG_44 | SVDD_F | VDD, AVDD Falling Ramp Rate to Ensure Internal Power-on Reset Signal |
— | — | 50 | mV/µs | Failure to meet this specification may cause the device to not detect reset |
REG_45 | VPOR | Power-on Reset | 0.97 | — | 1.64 | V | VDD Power up/Down (See Param REG_43, VDD Ramp Rate) |
REG_47 | VBOD33 (6,7) | VDD BOD (All modes) | 1.46 | — | 1.56 | V |
SUPC.BOD33.LEVEL[7:0] = 0x00 (Min Value) , SUPC.BOD33.HYST[3:0] = 0x02 |
1.61 | — | 1.71 |
SUPC.BOD33.LEVEL[7:0] = 0x19 (Recommended Value) , SUPC.BOD33.HYST[3:0] = 0x02 |
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1.63 | — | 1.73 |
SUPC.BOD33.LEVEL[7:0] = 0x1C (Recommended Value) , SUPC.BOD33.HYST[3:0] = 0x02 |
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2.95 | — | 3.12 |
SUPC.BOD33.LEVEL[7:0] = 0xFF (Max Value) , SUPC.BOD33.HYST[3:0] = 0x00 |
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REG_51 | VBOD33LEVEL_STEP | VBOD33 step size (SUPC.BOD33.LEVEL) | — | 6 | — | mV | Step Size |
REG_52 | VBOD33HYST_STEP | VBOD33 Hysteresis step size (SUPC.BOD33.HYST) | — | 6 | — | mV | Step Size |
REG_53 | TRST | External RESET valid active pulse width | 1 | — | — | µs | Minimum reset active time to guarantee CPU reset |
Note:
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