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RNBD350 Bluetooth® Low Energy Module Data Sheet
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Introduction
Features
Operational Conditions
RF/Analog Features
Applications
Package
1
Quick References
1.1
Reference Documentation
1.2
Acronyms and Abbreviations
2
Ordering Information
2.1
RNBD350
Module Ordering Information
3
Device Overview
3.1
Module Overview
3.2
Module Configuration
3.3
Device Programming
4
Electrical Characteristics
4.1
Absolute Maximum Ratings
4.2
DC Electrical Characteristics
4.3
Active Current Consumption DC Electrical Specifications
4.4
Sleep Current Consumption DC Electrical Specifications
4.5
Deep Sleep Current Consumption DC Electrical Specifications
4.6
XDS (Extreme Deep Sleep) Current Consumption DC Electrical Specifications
4.7
Power Supply DC Module Electrical Specifications
4.8
I/O PIN AC/DC Electrical Specifications
4.9
ADC Electrical Specifications
4.10
Bluetooth® Low Energy RF Characteristics
5
Basic Connection Requirement
5.1
Power Pins
5.2
Master Clear (
MCLR
) Pin
5.3
Unused I/O Pins
5.4
Interface Pins
6
Physical Dimensions and Attributes
6.1
RNBD350
Module Placement Guidelines
6.2
RNBD350
Module Routing Guidelines
6.3
RNBD350
Module Packaging Information
6.4
RNBD350
Module RF Considerations
6.5
RNBD350
Module Antenna Considerations
6.6
RNBD350
Module Reflow Profile Information
6.7
RNBD350
Module Assembly Considerations
7
ASCII Command API
8
Application Reference Schematics
9
Supported Bluetooth® Low Energy Profile and Services
10
Appendix A: Regulatory Approval
10.1
United States
10.2
Canada
10.3
Europe
10.4
Japan
10.5
Korea
10.6
Taiwan
10.7
China
10.8
UKCA (UK Conformity Assessed)
10.9
Other Regulatory Information
11
Document Revision History
Microchip Information
Trademarks
Legal Notice
Microchip Devices Code Protection Feature
