Product Identification System
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
| Device: |
ECC204: Pre-configured Cryptographic Coprocessor with secure hardware-based key storage |
|
| Trust Type | TFLX | Type of Microchip Trust Product |
| Trust Option | AUTH | Configuration associated with Trust Product |
| Package Options(1, 2) | U | 8-Pad 2 x 3 x 0.6 mm Body, Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead Package (UDFN) |
| S | 8-Lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC® SOIC) | |
| Interface Options | — | I2C Interface |
| CZ | SWI Interface | |
Examples:
- ECC204-TFLXAUTHU: TrustFLEX , Provisioned, 8-Pad 2 mm x 3 mm x 0.6 mm Body, Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead Package (UDFN), I2C , MOQ 2k units
- ECC204-TFLXAUTHU-CZ: TrustFLEX , Provisioned, 8-Pad 2 mm x 3 mm x 0.6 mm Body, Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead Package (UDFN), SWI, MOQ 2k units
- ECC204-TFLXAUTHS: TrustFLEX , Provisioned, 8-Lead (0.150" Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC), I2C, MOQ 2k units
- ECC204-TFLXAUTHS-CZ: TrustFLEX , Provisioned, 8-Lead (0.150" Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC), SWI, MOQ 2k units
Note:
- Product will be delivered as Tape and Reel. Actual size of reel will vary based on customer order. 2k units is the minimum order quantity (MOQ) allowed.
- The 3-Lead Contact package cannot be ordered through the low MOQ flow (2k units on Microchip Direct). The package option ECC204-RBVCZ can be selected through TPDS but must be ordered through the high volume flow. Contact Microchip Sales for more information on the MOQ.