51.2 CPU Electrical Characteristics

Table 51-3. Operating Frequency Versus Voltage
Param. No.VDDIOx, AVDD, VDDREG RangeTemp. Range (in °C)Max CPU FrequencyComments
DC_51.71V to 3.63V-40°C to +85°CFCLK_1 MHzIndustrial
Table 51-4. CPU Thermal Operating Conditions
RatingSymbolMin.Typ.Max.Unit
Industrial Temperature Devices

Operating Ambient Temperature Range

Operating Junction Temperature Range

TA

TJ

-40

85

105

°C
Power Dissipation:

Internal Chip Power Dissipation:

PINT = (VDDIOx x (IDD –∑ IOHVDDIOx)) + (VUSB3V3 x IDDUSB) + (AVDD x (IDDANA - ∑ IOHAVDD)) + (VDDREG x IDDREG)

I/O Pin Power Dissipation:

PI/O = ∑ ((VDDIOx – VOHVDDIOx) x IOHVDDIOx) + ∑ (VOL x IOLVDDIOx) + ∑ ((AVDD – VOHAVDD) x IOHAVDD) + ∑ (VOL x IOLAVDD)

PDPINT + PI/OW
Maximum Allowed Power DissipationPDMAX(TJ – TA)/θJAW
Table 51-5. Thermal Packaging Characteristics (1)
CharacteristicsSymbolTyp.Max.Unit
Thermal Resistance, 144-pin TQFP (16x16x1 mm) PackageθJA17.1°C/W
Thermal Resistance, 144-pin TFBGA (10x10x1.2 mm) PackageθJA28°C/W
Thermal Resistance, 100-pin eTQFP (14x14x1 mm) PackageθJA18.5°C/W
Thermal Resistance, 64-pin QFN (9x9x0.9 mm) PackageθJA18.6°C/W
Thermal Resistance, 64-pin TQFP (10x10x1 mm) PackageθJA21.3°C/W
Note:
  1. Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.