51.2 CPU Electrical Characteristics

Table 51-3. Operating Frequency Versus Voltage
Param. No.	VDDIOx, AVDD, VDDREG Range	Temp. Range (in °C)	Max CPU Frequency	Comments
DC_5	1.71V to 3.63V	-40°C to +85°C	FCLK_1 MHz	Industrial

Table 51-4. CPU Thermal Operating Conditions
Rating	Symbol	Min.	Typ.	Max.	Unit
Industrial Temperature Devices Operating Ambient Temperature Range Operating Junction Temperature Range	TA TJ	-40 —	—	85 105	°C
Power Dissipation: Internal Chip Power Dissipation: PINT = (VDDIOx x (IDD –∑ IOHVDDIOx)) + (VUSB3V3 x IDDUSB) + (AVDD x (IDDANA - ∑ IOHAVDD)) + (VDDREG x IDDREG) I/O Pin Power Dissipation: PI/O = ∑ ((VDDIOx – VOHVDDIOx) x IOHVDDIOx) + ∑ (VOL x IOLVDDIOx) + ∑ ((AVDD – VOHAVDD) x IOHAVDD) + ∑ (VOL x IOLAVDD)	PD	PINT + PI/O			W
Maximum Allowed Power Dissipation	PDMAX	(TJ – TA)/θJA			W

Table 51-5. Thermal Packaging Characteristics ⁽¹⁾
Characteristics	Symbol	Typ.	Max.	Unit
Thermal Resistance, 144-pin TQFP (16x16x1 mm) Package	θJA	17.1	—	°C/W
Thermal Resistance, 144-pin TFBGA (10x10x1.2 mm) Package	θJA	28	—	°C/W
Thermal Resistance, 100-pin eTQFP (14x14x1 mm) Package	θJA	18.5	—	°C/W
Thermal Resistance, 64-pin QFN (9x9x0.9 mm) Package	θJA	18.6	—	°C/W
Thermal Resistance, 64-pin TQFP (10x10x1 mm) Package	θJA	21.3	—	°C/W
Note: Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.