51.2 CPU Electrical Characteristics
Param. No. | VDDIOx, AVDD, VDDREG Range | Temp. Range (in °C) | Max CPU Frequency | Comments | ||
---|---|---|---|---|---|---|
DC_5 | 1.71V to 3.63V | -40°C to +85°C | FCLK_1 MHz | Industrial |
Rating | Symbol | Min. | Typ. | Max. | Unit | ||
---|---|---|---|---|---|---|---|
Industrial
Temperature Devices Operating Ambient Temperature Range Operating Junction Temperature Range | TA TJ | -40 — | — | 85 105 | °C | ||
Power
Dissipation: Internal Chip Power Dissipation: PINT = (VDDIOx x (IDD –∑ IOHVDDIOx)) + (VUSB3V3 x IDDUSB) + (AVDD x (IDDANA - ∑ IOHAVDD)) + (VDDREG x IDDREG) I/O Pin Power Dissipation: PI/O = ∑ ((VDDIOx – VOHVDDIOx) x IOHVDDIOx) + ∑ (VOL x IOLVDDIOx) + ∑ ((AVDD – VOHAVDD) x IOHAVDD) + ∑ (VOL x IOLAVDD) | PD | PINT + PI/O | W | ||||
Maximum Allowed Power Dissipation | PDMAX | (TJ – TA)/θJA | W |
Characteristics | Symbol | Typ. | Max. | Unit | |||
---|---|---|---|---|---|---|---|
Thermal Resistance, 144-pin TQFP (16x16x1 mm) Package | θJA | 17.1 | — | °C/W | |||
Thermal Resistance, 144-pin TFBGA (10x10x1.2 mm) Package | θJA | 28 | — | °C/W | |||
Thermal Resistance, 100-pin eTQFP (14x14x1 mm) Package | θJA | 18.5 | — | °C/W | |||
Thermal Resistance, 64-pin QFN (9x9x0.9 mm) Package | θJA | 18.6 | — | °C/W | |||
Thermal Resistance, 64-pin TQFP (10x10x1 mm) Package | θJA | 21.3 | — | °C/W | |||
Note:
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