51.22 Serial Peripheral Interface (SPI) Electrical Specifications

Figure 51-13. SPIx Host Module CPHA = 0 Timing Diagrams

Figure 51-14. SPIx Host Module CPHA = 1 Timing Diagrams

Table 51-31. SPIx Module Host Mode Electrical Specifications ⁽¹⁾
AC CHARACTERISTICS				Standard Operating Conditions: VDDREG = VDDIO = AVDD 1.71V to 3.63V (unless otherwise stated) Operating temperature: -40°C ≤ TA ≤ +85°C for Industrial
Param. No.	Symbol	Characteristics ⁽¹⁾		Min.	Typ.	Max.	Units	Conditions
MSP_1	FSCK	SCK Frequency	Normal Speed SERCOM	—	—	21.3	MHz	Transmitter mode, CTRB.RXEN = 0. VDDIOx = 1.8V or 3.3 V, CLOAD = 30 pF(max)
				—	—	21.3		Full Duplex Transmit and Receive modes, Loop-Back mode with one SPI communicating to another SPI on the same MCU. VDDIOx = 1.8V or 3.3V, CLOAD = 30 pF(max)
				—	—	1/(2*(TMIS+NOTE2_TV)) ⁽²⁾		Full Duplex Transmit and Receive modes, CLOAD = 30pF(max). The maximum SPI speed of the MCU is partially dependent on the external SPI device performance characteristics. Faster speeds than the Loop-Back mode above may therefore be possible using the formula.
			High-Speed SERCOM ⁽³⁾	—	—	48.1	MHz	Transmitter mode, CTRB.RXEN = 0. VDDIOx = 1.8V or 3.3 V, CLOAD = 20 pF(max)
			High-Speed SERCOM ⁽³⁾	—	—	1/(2*(TMIS_HS+NOTE2_TV)) ⁽²⁾	MHz	Full-Duplex Transmit and Receive modes, CLOAD = 20pF(max). The maximum SPI speed of the MCU is partially dependent on the external SPI device performance characteristics. Faster speeds than the Loop-Back mode above may therefore be possible using the formula.
MSP_3	TSCL	SCK Output Low Time		1/(2*FSCK)	—	—	µs	—
MSP_5	TSCH	SCK Output High Time		1/(2*FSCK)	—	—	µs	—
MSP_7	TSCF	SCK and MOSI Output Fall Time		—	—	DI_27 or DI_31	ns	See parameter in I/O Specifications
MSP_9	TSCR	SCK and MOSI Output Rise Time		—	—	DI_25 or DI_29	ns	See parameter in I/O Specifications
MSP_11	TMOV	MOSI Data Output Valid after SCK	Normal Speed SERCOM	—	—	10	ns	—
MSP_11	TMOV	MOSI Data Output Valid after SCK	High Speed SERCOM ⁽³⁾	—	—	4	ns	—
MSP_13	TMOH	MOSI hold after SCK		0	—	—	ns	—
MSP_15A	TMIS	MISO Setup Time of Data Input to SCK	Normal Speed SERCOM	15	—	—	ns	—
MSP_15A	TMIS	MISO Setup Time of Data Input to SCK	High Speed SERCOM⁽³⁾	1	—	—	ns	—
MSP_17	TMIH	MISO Hold Time of Data Input to SCK	Normal Speed SERCOM	0	—	—	ns	—
MSP_17	TMIH	MISO Hold Time of Data Input to SCK	High Speed SERCOM ⁽³⁾	2	—	—	ns	—
MSP_19	SPI_GCLK	SERCOM SPI input clock frequencies, GCLK_SPI		—	—	FCLK_23	MHz	—
Note: Assuming 30 pF external load on all SPIx pins unless otherwise noted. NOTE2_TV is the client external device data output valid time from clock edge specification. SERCOM0 pins: PC10, PC11, PC12, PC13.

Figure 51-15. SPIx Client Mode CPHA = 0 Timing Diagrams

Figure 51-16. SPIx Client Mode CPHA = 1 Timing Diagrams

Table 51-32. SPIx Module Client Mode Electrical Specifications
AC CHARACTERISTICS				Standard Operating Conditions: VDDREG = VDDIO = AVDD 1.71V to 3.63V (unless otherwise stated) Operating temperature: -40°C ≤ TA ≤ +85°C for Industrial
Param. No.	Symbol	Characteristics⁽¹⁾		Min.	Typical	Max.	Units	Conditions
SSP_1	FSCK	SCK Frequency	Normal Speed SERCOM	—	—	21.3	MHz	Receiver mode. VDDIOx = 1.8V or 3.3V, CLOAD = 30 pF(max)
				—	—	21.3		Full-Duplex Transmit and Receive modes, Loop-Back mode with one SPI communicating to another SPI on the same MCU. VDDIOx = 1.8V or 3.3V, CLOAD = 30 pF(max)
				—	—	1/(2*(TSOV+NOTE2_TMIS)) ⁽²⁾		Full- Duplex Transmit and Receive modes, CLOAD = 30pf(max). The max SPI speed of the MCU is partially dependent on the external SPI device performance characteristics. Faster speeds than the Loop-Back mode above may therefore be possible using the formula.
			High-Speed SERCOM ⁽³⁾	—	—	48.1	MHz	Receiver mode. VDDIOx = 1.8V or 3.3V, CLOAD = 20 pF(max)
			High-Speed SERCOM ⁽³⁾	—	—	1/(2*(TSOV_HS+NOTE2_TMIS)) ⁽²⁾	MHz	Full-Duplex Transmit and Receive modes, CLOAD = 20pF(max). The maximum SPI speed of the MCU is partially dependent on the external SPI device performance characteristics. Faster speeds than the Loop-Back mode above may therefore be possible using the formula.
SSP_3	TSCL	SCK Output Low Time		1/(2*FSCK)	—	—	µs	—
SSP_5	TSCH	SCK Output High Time		1/(2*FSCK)	—	—	µs	—
SSP_7	TSCF	SCK and MOSI Output Fall Time		—	—	DI_27 or DI_31	ns	See parameter in I/O spec
SSP_9	TSCR	SCK and MOSI Output Rise Time		—	—	DI_25 or DI_29	ns	See parameter in I/O spec
SSP_11A	TSOV	MISO Data Output Valid after SCK	Normal Speed SERCOM	—	—	25	ns	—
SSP_11A	TSOV	MISO Data Output Valid after SCK	High Speed SERCOM ⁽³⁾	—	—	10	ns	—
SSP_13	TSOH	MISO hold after SCK		4	—	—	ns	—
SSP_15	TSIS	MOSI Setup Time of Data Input to SCK	Normal Speed SERCOM	6	—	—	ns	—
SSP_15	TSIS	MOSI Setup Time of Data Input to SCK	High Speed SERCOM ⁽³⁾	2	—	—	ns	—
SSP_17	TSIH	MOSI Hold Time of Data Input to SCK	Normal Speed SERCOM	0	—	—	ns	—
SSP_17	TSIH	MOSI Hold Time of Data Input to SCK	High Speed SERCOM ⁽³⁾	1	—	—	ns	—
SSP_19	TSSS	SS setup to SCK (PRELOADEN=0)	Normal Speed SERCOM	5	—	—	ns	—
SSP_19	TSSS	SS setup to SCK (PRELOADEN=0)	High Speed SERCOM ⁽³⁾	2	—	—	ns	—
SSP_21	TSSH	SS hold after SCK Client	Normal Speed SERCOM	0	—	—	ns	—
SSP_21	TSSH	SS hold after SCK Client	High Speed SERCOM⁽³⁾	1	—	—	ns	—
SSP_23	SPI_GCLK	SERCOM SPI input clk freq, GCLK_SPI		—	—	FCLK_23	MHz	—
Note: Assuming and 30 pF external load on all SPIx pins unless otherwise noted. NOTE2_TMIS is the Host external device setup time. SERCOM0 pins: PC10, PC11, PC12, PC13.