51.26 SQI/QSPI Electrical Specifications
AC CHARACTERISTICS | Standard
Operating Conditions: VDDREG=VDDIO=AVDD 1.71V to 3.63V (unless otherwise
stated) Operating temperature: -40°C ≤ TA ≤ +85°C for Industrial | |||||||
---|---|---|---|---|---|---|---|---|
Param. No. | Symbol | Characteristics | Min. | Typ. | Max. | Units | Conditions | |
QSPI_1 | FCLK | SQI Serial Clock Frequency | — | — | 83 | MHz | SDR Read VDDIOx = 3.3V, CLOAD = 30 pF(MAX) | |
— | — | 69 | MHz | SDR Read VDDIOx = 1.8V, CLOAD = 30 pF(MAX) | ||||
— | — | 118 | MHz | SDR Write VDDIOx = 3.3V, CLOAD = 30 pF(MAX) | ||||
— | — | 100 | MHz | SDR Write VDDIOx = 1.8V, CLOAD = 30 pF(MAX) | ||||
— | — | 66 | MHz | DDR Read VDDIOx = 3.3V, CLOAD = 30 pF(MAX) | ||||
— | — | 56 | MHz | DDR Read VDDIOx = 1.8V, CLOAD = 30 pF(MAX) | ||||
QSPI_3 | TSCKH | Serial Clock High Time | 1/(2*FCLK) | — | — | µs | — | |
QSPI_5 | TSCKL | Serial Clock Low Time | 1/(2*FCLK) | — | — | µs | — | |
QSPI_7 | TSCKR | Serial Clock Rise Time | — | — | DI_29 | ns | See parameter in I/O Specifications | |
QSPI_9 | TSCKF | Serial Clock Fall Time | — | — | DI_31 | ns | See parameter in I/O Specifications | |
QSPI_11 | TCSS | CS Active Setup Time | SDR | 14 | — | — | ns | — |
DDR | 16 | — | — | ns | — | |||
QSPI_13 | TCSH | CS Active Hold Time | 0 | — | — | ns | — | |
QSPI_15 | TCHS | CS Not Active Setup Time | SDR | 7 | — | — | ns | — |
DDR | 9 | — | — | ns | — | |||
QSPI_17 | TCHH | CS Not Active Hold Time | 0 | — | — | ns | — | |
QSPI_19 | TDIS | Data In Setup Time | SDR | 1 | — | — | ns | — |
DDR | 2 | — | — | ns | — | |||
QSPI_21 | TDIH | Data In Hold Time | SDR | 1 | — | — | ns | — |
DDR | 1 | — | — | ns | — | |||
QSPI_23 | TDOH | Data Out Hold | 0 | — | — | ns | — | |
QSPI_25 | TDOV | Data Out Valid | SDR | — | — | 2 | ns | — |
DDR | — | — | 5 | ns | — | |||
QSPI_27 | QSPI_GCLK | GCLK_QSPI | — | — | FCLK_73 | MHz | — | |
Note:
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