52.3 Soldering Profile

The following table gives the recommended soldering profile from J-STD-20.

Table 52-1. Recommended Soldering Profile
Profile FeatureGreen Package
Average Ramp-up Rate (217°C to peak)3°C/s max.
Preheat Temperature 175°C ±25°C150-200°C
Time Maintained Above 217°C60-150s
Time within 5°C of Actual Peak Temperature30s
Peak Temperature Range260°C
Ramp-down Rate6°C/s max.
Time 25°C to Peak Temperature8 minutes max.

A maximum of three reflow passes is allowed per component.