7.1 Soldering Recommendations

The BM20/23 module is assembled using a standard lead‐free reflow profile IPC/JEDEC J‐STD‐020. The BM20/23 module can be soldered to the main PCB using standard leaded and lead‐free solder reflow profiles.

To avoid the damage to the module, follow these recommendations:

• Refer to Microchip Technology Application Note AN233 Solder Reflow Recommendation (DS00233) for the soldering reflow recommendations
• Do not exceed peak temperature (T_P) of +250℃
• Refer to the Solder Paste data sheet for specific reflow profile recommendations
• Use no‐clean flux solder paste
• Do not wash the module, as moisture can be trapped under the shield
• Use only one flow. If the PCB requires multiple flows, apply the module on the final flow