42.3.6 Thermal Characteristics


Standard Operating Conditions (unless otherwise stated)
Param No.	Sym.	Characteristic	Typ.	Units	Conditions
TH01	θ_JA	Thermal Resistance Junction to Ambient	95.3	°C/W	8-pin SOIC package
			77.7	°C/W	14-pin SOIC package
			100	°C/W	14-pin TSSOP package
			62.2	°C/W	20-pin PDIP package
			31.1	°C/W	20-pin SSOP package
			43.0	°C/W	20-pin VQFN package
TH02⁽¹⁾	T_JMAX	Maximum Junction Temperature	150	°C
Note: See the "Absolute Maximum Ratings" section for total power dissipation.

DS40002686B

The online versions of the documents are provided as a courtesy. Verify all content and data in the device’s PDF documentation found on the device product page.