9.2 289-ball TFBGA

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.
Table 9-1. 289-ball TFBGA Package Characteristics
Moisture Sensitivity Level3
Table 9-2. Device and 289-ball TFBGA Package Weight
Device Weight (mg)
ATSAMA5D27C-D5M (512 Mb)390
ATSAMA5D28C-D1G (1 Gbit)400
Table 9-3. Package Reference
JEDEC Drawing ReferenceNA
J-STD-609 Classificatione8
Table 9-4. 289-ball TFBGA Package Information
Ball Land0.450 mm ±0.05
Nominal Ball Diameter0.4 mm
Solder Mask Opening0.350 mm ±0.05
Solder Mask DefinitionSMD
SolderOSP