Note: For the most current package drawings, please see the Microchip Packaging Specification
located at http://www.microchip.com/packaging.

Table 9-1. 289-ball TFBGA Package CharacteristicsMoisture Sensitivity Level | 3 |
Table 9-2. Device and 289-ball TFBGA Package WeightDevice | Weight (mg) |
---|
ATSAMA5D27C-D5M (512 Mb) | 390 |
ATSAMA5D28C-D1G (1 Gbit) | 400 |
Table 9-3. Package ReferenceJEDEC Drawing Reference | NA |
J-STD-609 Classification | e8 |
Table 9-4. 289-ball TFBGA Package InformationBall Land | 0.450 mm ±0.05 |
Nominal Ball Diameter | 0.4 mm |
Solder Mask Opening | 0.350 mm ±0.05 |
Solder Mask Definition | SMD |
Solder | OSP |