39.2 Absolute Maximum Ratings

Stresses beyond those listed in this section may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Table 39-1. Absolute Maximum Ratings
ParameterConditionRatingUnits
Ambient temperature under bias-40 to +125°C
Storage temperature-65 to +150°C
Voltage on Pins With Respect to GND
  • On the VDD pin
-0.3 to +6.5V
  • On the VDDIO2 pin
-0.3 to +6.5V
  • On the RESET pin
-0.3 to (VDD + 0.3)V
  • On all other pins
-0.3 to (VDD + 0.3)V
Maximum Current
  • On the GND pin(1)
-40°C ≤ TA ≤ +85°C350 mA
+85°C < TA ≤ +125°C120 mA
  • On the VDD pin(1)
-40°C ≤ TA ≤ +85°C350 mA
+85°C < TA ≤ +125°C120 mA
  • On the VDDIO2 pin(1)
-40°C ≤ TA ≤ +85°C350mA
+85°C < TA ≤ +125°C120 mA
  • On any standard I/O pin
±50 mA
Clamp current, IK (VPIN < 0 or VPIN > VDD)±20 mA
Total power dissipation(2)800 mW
Note:
  1. The maximum current rating requires even load distribution across I/O pins. The maximum current rating may be limited by the device package power dissipation characterizations, see the Thermal Characteristics section to calculate device specifications.
  2. Power dissipation is calculated as follows: PDIS = VDD × {IDD - Σ IOH} + Σ {(VDD - VOH) × IOH} + Σ (VOI × IOL)