40.4.1 Thermal Resistance Data
The following table summarizes the thermal resistance data depending on the package:
| Pin Count | Package Type | θJA [°C/W] | θJC [°C/W] |
|---|---|---|---|
| 20 | SOIC | 44 | 21 |
| 24 | VQFN | 60.6 | 25 |
The following table summarizes the thermal resistance data depending on the package:
| Pin Count | Package Type | θJA [°C/W] | θJC [°C/W] |
|---|---|---|---|
| 20 | SOIC | 44 | 21 |
| 24 | VQFN | 60.6 | 25 |
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