10 Package Drawing

20-Pin VQFN

20-Lead Very Thin Plastic Quad Flat, No Lead Package (REB) - 3x3 mm Body [VQFN] with 1.7 mm Exposed Pad

Note: For the most current package drawings, see the Microchip Packaging Specification located at www.microchip.com/packaging.
Note:
  1. Pin 1 visual index feature may vary, but must be located within the hatched area.
  2. Package is saw singulated.
  3. Dimensioning and tolerancing per ASME Y14.5M:

    BSC: Basic Dimension. Theoretically, the exact value is shown without tolerances.

    REF: Reference Dimension, usually without tolerance, for information purposes only.

Note:
  1. Dimensioning and tolerancing per ASME Y14.5M:

    BSC: Basic Dimension. Theoretically, the exact value is shown without tolerances.

  2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during the reflow process.
Table 10-1. Device and Package Maximum Weight
Device and Package Maximum Weight19.1 mg
Table 10-2. Package Reference
JEDEC Drawing ReferenceN/A
JESD97 ClassificationE3

20-Pin SOIC

20-Lead Plastic Small Outline (SO) - Wide, 70.50 mm Body [SOIC]

Note: For the most current package drawings, see the Microchip Packaging Specification located at www.microchip.com/packaging.
Table 10-3. Device and Package Maximum Weight
Maximum Weight542 mg
Table 10-4. Package Reference
JEDEC Drawing ReferenceN/A
JESD97 ClassificationE3