49.2 General Operating Ratings and Thermal Conditions

Table 49-2. Operating Frequency vs. Voltage (PIC32CM LE00 / PIC32CM LS00)
Param. No.VDD, AVDD RangeTemp. Range (in °C)Max CPU FrequencyComments
DC_51.62V to 3.63V (1)-40°C to +85°C12 MHzIndustrial

Performance Level 0 Mode (PL0)

DC_5A48 MHzIndustrial

Performance Level 2 Mode (PL2)

Note: The same voltage must be applied to VDD and AVDD.
Table 49-3. Operating Frequency vs. Voltage (PIC32CM LS60)
Param. No.VDD, AVDD RangeTemp. Range (in °C)Max CPU FrequencyComments
DC_152.0V to 3.63V (1)-40°C to +85°C12 MHzIndustrial

Performance Level 0 Mode (PL0)

DC_15A48 MHzIndustrial

Performance Level 2 Mode (PL2)

Note: The same voltage must be applied to VDD and AVDD.
Table 49-4. Thermal Operating Conditions
RatingSymbolMin.Typ.Max.Unit
Industrial Temperature Devices:

Operating Ambient Temperature Range

Operating Junction Temperature Range

TA

TJ

-40

—

—

—

85

105

°C

Power Dissipation: Internal Chip Power Dissipation:

PINT = VDD x (IDD –Σ IOHVDD) + AVDD x (IDDANA –Σ IOHAVDD)

I/O Pin Power Dissipation:

PI/O = Σ ((VDD –VOH) x IOHVDD) + Σ (VOL x IOLVDD) + Σ ((AVDD –VOH) x IOHAVDD) + Σ (VOL x IOLAVDD)

PDPINT + PI/OW
Maximum Allowed Power DissipationPDMAX(TJ – TA)/θJAW
Table 49-5. Thermal Packaging Characteristics (PIC32CM LE00/LS00) (1)
CharacteristicsSymbolTyp.Max.Unit
Thermal Resistance, 48-pin TQFP (7x7x1.0 mm) PackageθJA50-°C/W
Thermal Resistance, 48-pin VQFN (7x7x0.9 mm) Package25-
Thermal Resistance, 64-pin TQFP (10x10x1.0 mm) Package46-
Thermal Resistance, 64-pin VQFN (9x9x1.0 mm) Package22-
Thermal Resistance, 100-pin TQFP (14x14x1.0 mm) Package42-
Note:
  1. Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.
Table 49-6. Thermal Packaging Characteristics (PIC32CM LS60) (1)
CharacteristicsSymbolTyp.Max.Unit
Thermal Resistance, 48-pin VQFN (7x7x0.9 mm) PackageθJA30-°C/W
Thermal Resistance, 64-pin TQFP (10x10x1.0 mm) Package51-
Thermal Resistance, 64-pin VQFN (9x9x1.0 mm) Package27-
Thermal Resistance, 100-pin TQFP (14x14x1.0 mm) Package47-
Note:
  1. Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.