56 Data Sheet Revision History

Note: The data sheet revision is independent of the silicon revision. Refer to the Device Service Unit chapter for detailed information on Device Identification and Revision IDs for your specific device.

Revision J - December 2024

The following changes were incorporated in this revision:

SectionUpdates
Ordering Information
  • Updated Content to reflect the addition of Extended Temperature parts
Extended Temperature Electrical Characteristics (125°C)
  • New section

Revision H - April 2024

The following changes were incorporated in this revision:

SectionUpdates
Introduction
  • Added a new section for Software Tools and Support
Configuration Summary
  • Updated Note 1 with new information for all tables
Block Diagram
  • Updated Note 1 with new information
Signal Descriptions
  • Updated Note 1 with new information
Peripherals
Processor and Architecture
PAC
  • Added a new note to the PERID bitfield of the WRCTRL register
GCLK
  • Updated the Important note in the GEN bitfield of the PCHCTRLm register
DMAC
  • Updated the Important note to the TRGSRC bitfield in the CHCTRLB Register
SERCOM
SERCOM-USART
TC
Packaging Information

Revision G - November 2022

The following changes were incorporated in this revision:

SectionUpdates
Introduction
  • Updates to the specifications for Memories, System, Communication Interfaces, Advanced Analog, and Input/Output
  • Added new packaging information to the Packages table for the 32 Lead packages
Configuration Summary
  • Updated Table 1-1 with new specifications for the PIC32CM LS00 Family of devices
  • Replaced Table 1-2 with all new content
Ordering Information
  • Updated the Diagram with new information for 32-pin VQFN and TQFP devices
Block Diagram
  • Updated the Diagram with new specifications for Flash size, RAM size, and added a new note
Pinout and Packaging
Signal Descriptions
  • Added new notes for the TCCx, I2C, and VREFA
Product Mapping
  • Added notes to the instances of TCCx and I2S
Peripherals
Memories
  • Updated Table 10-1 in Embedded Memories with a new column denoting LE00/LS00 content
  • Updated Table 10-2 in Flash with a new row denoting LE00/LS00 content
  • Updated Table 10-4 in Data Flash with a new row denoting LE00/LS00 content
  • Updated Table 10-6 in SRAM and added a new table 10-7 for SRAM Sub-Blocks size
  • Added a table to TrustRAM
Processor and Architecture
SUPC
  • Added new BOD33 text to the BOD33RDY bitfield in the STATUS Register
PM
  • Added a new table for 128-KB Flash to the RAMPSWC bitfield in the PWCFG Register
DMAC
  • Added a note to the TRGSRC bitfield in the CHCTRLB Register
PORT
  • Added a note to Events for Standby Mode
EVSYS
  • Clarified verbiage in Features
  • Added a new table for the EVGEN bitfield of the CHANNELn Register
  • Added in a new User Multiplexer Table for the USERm Register
SERCOM
SERCOM I2C
USB
  • Updated text in the EPINTENSETn Register to clarify Register reset
ADC
Electrical Characteristics
Packaging Information

Revision F - July 2022

The following changes were incorporated in this revision:
SectionUpdates
Configuration Summary
  • Updated Table 1-2 to remove deprecated devices
  • Ordering Information was updated with Tape and Reel in the revision history which was not in the previous revision.
Pinout and Packaging
Memories
  • Updated Table 10-1 in Embedded Memories with a new device designation for PIC32CM2532 devices
  • Updated Table 10-2 in Flash with a new device designation for PIC32CM2532 devices
  • Updated Table 10-4 in Data Flash with a new device designation for PIC32CM2532 devices
  • Updated Table 10-6 in SRAM with a new device designation for PIC32CM2532 devices
SERCOM USART
Electrical Characteristics at 85°C
Schematic Checklist
Appendix A

Revision E - April 2022

The following changes were made to this document:
SectionUpdates
Features
  • Updated the naming for the ATECC608B-TFLXTLS
Configuration SummaryTable 1-1. PIC32CM LE00/LS00/LS60 Family Features
Memories
PIC32CM LS00/LS60 Specific Security Features
Boot ROM
  • Added new content to refer to Region Unlock Bits in Chip Erase
IDAUUpdated the following registers: SCFGB, SCFGA, and SCFGR
NVMCTRL
SERCOM USART
SERCOM I2C
TRNG
Analog Peripherals Considerations
OPAMP
TCUpdated the CTRLBCLR register
TCCUpdated these registers: CTRLBCLRand CTRLBSET
Electrical Characteristics at 85°C
  • Removed sections of data for the PDSW Domain in Retention from the MCU Standby Current Consumption Electrical Specifications table

Revision D - February 2022

Revision C - February 2022

Along with the changes listed below, numerous typographical updates were done to the document.

SectionUpdates
512-KB Flash, 64-KB SRAM with TrustZone, Crypto & Enhanced PTC
  • Added new information to the Timers/Output Compare/Input Capture section for PWM Modes using TC and TCC peripherals
  • Updated anti-tamper verbiage for TrustRAM
  • Minor reformatting of the features arrangement
Configuration Summary
  • Updated the entries for the TC and TCC
PIC32CM LS00/LS60 Specific Security Features
Memories
  • Updated the Flash topic with new verbiage to enable the cache
MCLK
OSCCTRL
SUPC
  • Updated Voltage Regulators with new Active Mode verbiage
  • Updated the BOD33 Register to display the VREFSEL bitfield name instead of REFSEL
PM
  • Made a minor typographical update to the INTFLAG Register
RTC
NVMCTRL
TRAM
  • Updated the Anti-Tamper verbiage in Features
PORT
EVSYS
SERCOM
SERCOM USART
  • Updated the MAXITER bitfield with new verbiage in the CTRLC Register
SERCOM SPI
SERCOM I2C
  • Updated the DRDY Bitfield with new verbiage for the Client INTFLAG Register
  • Updated the Bitfield access properties for the CMD and QCEN bits in the Host CTRLB Register
TC
TCC
CCL
AC
ADC
  • Updated the verbiage and equation for the SAMPLEN bitfield in the SAMPCTRL Register
DAC
Electrical Characteristics
Packaging InformationUpdated the 64-pin VQFN package to the most recent version
Schematic Checklist

Revision B - November 2020

Along with the changes listed below, numerous typographical updates were done to the document.

The following changes were made to this document:

SectionUpdates
512-KB Flash, 64-KB SRAM with TrustZone, Crypto & Enhanced PTCUpdated Core section with a new information for DMIPS
PIC32CM LS00/LS60 Specific Security FeaturesAdded a new topic ATECC608 CryptoAuthentication Device (PIC32CM LS60 only)
Boot ROMAdded a new topic ATECC608x -Based Secure Boot Verification Method
Memories
PACUpdated the table for the KEY bit of the WRCTRL Register with the value of SETLOCK for 0x3
DSUUpdated the REVISION Bit of the DID register with information for silicon revisions A0, A1, and B0
OSC32KCTRLAdded a Reserved field to the table for the STARTUP bit in the XOSC32K Register
PMUpdated Sleep Modes with new verbiage
RTCUpdated the COUNT register with a new note
SERCOM SPIUpdated the CTRLB Register for the AMODE bit correcting 2_ADDRS to 2ADDRS
SERCOM I2CUpdated the CTRLB Register for the AMODE bit correcting 2_ADDRS to 2ADDRS
TCCUpdated the EVCTRL Register with new values in the tables for the CNTSEL and EVACT Bits
CCLCorrected the INSELx bit of the LUTCTRL Register to read [x=0..2]
ACUpdated the table for the MUXPOS Bit of the COMPCTRL Register with a new reserved value for 0x5-0x7
OPAMPUpdated the RESCTRL Register with a new table value for 0x0 for the RES1MUX Bit
Electrical Characteristics
Schematic Checklist

Revision A - March 2020

This is the initial released version of this document.