SAMA5D2 Series

67.3 196-Ball Thin Fine Pitch Ball Grid Array (BAB) - 11x11 mm Body [TFBGA]

Table 67-9. 196-ball TFBGA Package Characteristics
Moisture Sensitivity Level	3

Table 67-10. Device and 196-ball TFBGA Package Weight
234.2	mg

Table 67-11. Package Reference
JEDEC Drawing Reference	NA
J-STD-609 Classification	e8

Table 67-12. 196-ball TFBGA Package Information
Ball Land	0.350 mm ±0.05
Nominal Ball Diameter	0.3 mm
Solder Mask Opening	0.275 mm ±0.30
Solder Mask Definition	SMD
Solder	OSP

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