SAMA5D2 Series

67.2 256-Ball Thin Fine Pitch Ball Grid Array (AYB) - 8x8x1.05 mm Body [TFBGA]

Table 67-5. 256-ball TFBGA Package Characteristics
Moisture Sensitivity Level	3

Table 67-6. Device and 256-ball TFBGA Package Weight
110.3	mg

Table 67-7. Package Reference
JEDEC Drawing Reference	NA
J-STD-609 Classification	e8

Table 67-8. 256-ball TFBGA Package Information
Ball Land	0.350 mm ±0.05
Nominal Ball Diameter	0.25 mm
Solder Mask Opening	0.250 mm ±0.05
Solder Mask Definition	SMD
Solder	OSP

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