11 Revision History

Revision C (April 2021)

Replaced terminology “Master” and “Slave” with “Host” and “Client”, respectively. Added note to Table 4-6 that explains the array architecture and how endurance is specified. Updated TSSOP and UDFN package drawings.

Revision B (March 2020)

Revised Noise Suppression Time (t_I) from 100 ns to 50 ns. Updated SOIC 8-Lead package drawing.

Revision A (March 2019)

Updated to the Microchip template. Microchip DS20006161 replaces Atmel document 8720. Corrected t_LOW typo from 400 ns to 500 ns. Corrected t_AA typo from 550 ns to 450 ns. Deleted the AT24C512C‑CUMHY‑T package options. Updated Part Marking Information. Updated the “Software Reset” section. Added ESD rating. Removed lead finish designation. Updated trace code format in package markings. Updated section content throughout for clarification. Added a figure for “System Configuration Using Two‑Wire Serial EEPROMs”. Added POR recommendations section. Updated the SOIC, SOIJ, TSSOP and UDFN package drawings to Microchip format.

Atmel Document 8720 Revision G (September 2015)

Added AT24C512C‑CUMHY‑T package option.

Atmel Document 8720 Revision F (January 2015)

Added the UDFN expanded quantity option. Updated package outline drawings and the ordering information section.

Atmel Document 8720 Revision E (August 2013)

Corrected spelling error. Corrected subscript pin names on pinouts. Updated the I_CC1 and I_CC2 supply currents in the DC Characteristics table.

Atmel Document 8720 Revision D (March 2013)

Added 8U‑8 WLCSP package offering. Updated related information throughout document. Updated footers and disclaimer page.

Atmel Document 8720 Revision C (July 2012)

Updated part markings. Updated package drawings. Updated template.

Atmel Document 8720 Revision B (December 2012)

Replaced part markings with single page standard marking. Removed five ordering code combinations.

Atmel Document 8720 Revision A (September 2010)

Initial document release.