Product Identification System
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
| Device: |
ATECC608B: Cryptographic Co-processor with Secure Hardware-based Key Storage | |
| Package Options(3) | SS | 8-Lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) |
| MA | 8-Pad 2 x 3 x 0.6 mm Body, Thermally Enhanced Plastic Ultra Thin Dual Flat NoLead Package (UDFN) | |
| RB | 3RB, 3-Lead 2x5 x 6.5mm Body, 2.0mm pin pitch, Contact Package (Sawn) | |
| Temperature Range | H | Standard Industrial Temperature Range: -40 ℃ to 85 ℃ |
| V | Extended Industrial Temperature Range: -40 ℃ to 100 ℃ | |
| I/O Type | CZ | Single Wire Interface |
| DA | I2C Interface | |
| Tape and Reel Options | B | Tube |
| T | Large Reel (Size varies by package type) | |
| S | Small Reel (Only available for MA Package Type) | |
Device Ordering Codes
| Temperature Range | Description | |
|---|---|---|
| Standard Industrial | Extended Industrial | |
| ATECC608B-SSHCZ-T | ATECC608B-SSVCZ-T | 8-Lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC), Single-Wire, Tape and Reel, 4,000 per Reel |
| ATECC608B-SSHCZ-B | ATECC608B-SSVCZ-B | 8-Lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC), Single-Wire, Tube, 100 per Tube |
| ATECC608B-SSHDA-T(4) | ATECC608B-SSVDA-T | 8-Lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC), I2C, Tape and Reel, 4,000 per Reel |
| ATECC608B-SSHDA-B(4) | ATECC608B-SSVDA-B | 8-Lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC), I2C, Tube, 100 per Tube |
| ATECC608B-MAHCZ-T | ATECC608B-MAVCZ-T | 8-Pad 2 x 3 x 0.6 mm Body, Thermally Enhanced Plastic Ultra Thin Dual Flat NoLead Package (UDFN), Single-Wire, Tape and Reel, 15,000 per Reel |
| ATECC608B-MAHDA-T(5) | ATECC608B-MAVDA-T | 8-Pad 2 x 3 x 0.6 mm Body, Thermally Enhanced Plastic Ultra Thin Dual Flat NoLead Package (UDFN), I2C, Tape and Reel, 15,000 per Reel |
| ATECC608B-MAHCZ-S | ATECC608B-MAVCZ-S | Pad 2 x 3 x 0.6 mm Body, Thermally Enhanced Plastic Ultra Thin Dual Flat NoLead Package (UDFN), Single-Wire, Tape and Reel, 3,000 per Reel |
| ATECC608B-MAHDA-S(5) | ATECC608B-MAVDA-S | 8-Pad 2 x 3 x 0.6 mm Body, Thermally Enhanced Plastic Ultra Thin Dual Flat NoLead Package (UDFN), I2C, Tape and Reel, 3,000 per Reel |
| ATECC608B-RBHCZ-T | ATECC608B-RBVCZ-T | Single-Wire, Tape and Reel, 5,000 per Reel, 3-Lead Contact Package |
| ATECC608B-RBHCZ-B | ATECC608B-RBVCZ-B | Single-Wire, Tube, 56 per Tube, 3-Lead Contact Package |
Note:
- Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option.
- Small form-factor packaging options may be available. Please check www.microchip.com/packaging for small-form factor package availability, or contact your local Sales Office.
- Die-on-Tape and Reel and WLCSP packages are available for qualified customers. Ordering codes for these packages are not shown in this table. Please contact Microchip sales for more information on these package options.
- These products are also available as sample units for the TrustCUSTOM variant ATECC608B-TCSMS. More information on Trust Platform secure elements can be found in ATECC608B Trust Platform Variants and Provisioning Services.
- These products are also available as sample units for the TrustCUSTOM variant ATECC608B-TCSMU. More information on Trust Platform secure elements can be found in ATECC608B Trust Platform Variants and Provisioning Services.