11.1 243-Ball TFBGA Mechanical Characteristics

Table 11-1. 243-ball TFBGA Package Characteristics
Moisture sensitivity levelMSL3
Table 11-2. Device and 243-ball TFBGA Package Weight
520mg
Table 11-3. Package Reference
JEDEC drawing referenceNA
J-STD-609 classificatione8
Table 11-4. 243-ball TFBGA Package Information
Ball land0.450 mm
Nominal ball diameter0.400 mm
Solder mask opening0.350 mm
Solder mask definitionSolder Mask Defined (SMD)
SolderSAC105