LAN8650/1

9.4 Package Thermal Specifications

Note: Thermal parameters are measured or estimated for devices in a multi-layer 2S2P PCB per JESD51.

Table 9-5. LAN8650/1 Package Thermal Parameters (32-VQFN)
Parameter	Symbol	Value	Units	Notes
Junction-to-Ambient	Θ_JA	43	°C/W	Still air
Junction-to-Top-of-Package	Ψ_JT	0.6	°C/W	Still air
Junction-to-Case	Θ_JC	7.6	°C/W

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