1 Device Differences
The overall structure of the ATECC608B is identical to that of the ATECC608A. The ATECC608B does not introduce any new configuration bits and has the same number of data slots as that of the ATECC608A. All commands and command modes are still supported. The device supports both the I2C and SWI interface I/O protocols. The pinouts for the 8-pin SOIC and UDFN packages remain unchanged.
The following sections describe the differences between the ATECC608A and the ATECC608B devices.
Low-Frequency I²C Issue
- Multiple I2C devices are on the same bus as the ATECC608A.
- The ATECC608A device was in Idle mode.
- The I2C operation frequency is ≤ 300 kHz.
- A data pattern from other devices on the I2C bus could be interpreted by the ATECC608A as a wake pulse.
Under the above conditions, the ATECC608A wakes up and may corrupt data being sent to other devices on the bus. Whether or not data are corrupted depends on the frequency of operation and the actual data being sent.
This issue has been corrected for the ATECC608B device by modifying the I2C circuitry to eliminate this issue. Note that the ATECC608B may still wake up at low frequency but it does not respond or cause data corruption.
Device Revision (DevRev) Differences
Info
command. The
output response of the Info
command for each device is as
follows:Device | Revision Response |
---|---|
ATECC608A | 0x00 0x00 0x60 0x02 |
ATECC608B | 0x00 0x00 0x60 0x03 (Note) |
Execution Time Differences
Command | Description of Changes |
---|---|
Verify |
|
SecureBoot |
|
Read |
|
Lock |
|
Enhanced Temperature Range
The ATECC608A is specified over the industrial temperature range of -40℃ to +85℃.
The ATECC608B is specified over the standard industrial range of -40℃ to +85℃ and an extended range of -40℃ to +100℃, for those users that need an upper ambient temperature value > +85℃. The enhanced temperature range devices have a unique ordering code that is found in the device’s data sheet.
New Packages
The ATECC608B is now available in a 3-pin RBH contact package. This is in addition to the already existing 8-pin SOIC and UDFN packages. This package has been used previously for the ATSHA204A and the ATECC508A CryptoAuthentication devices. The RBH package is only available for devices in SWI interface mode.
The RBH package is a contact package that is typically mounted by gluing the package to an enclosure with the signal pads exposed. Contacts to the pads are usually made through pogo pins when the disposable unit is connected to the host system.