9.2 196-Ball TFBGA

Table 9-5. 196-Ball TFBGA Package Characteristics
Moisture Sensitivity Level3
Table 9-6. Device and 196-Ball TFBGA Package Weight
Device Weight (mg)
SAM9X60D6K251
Table 9-7. Package Reference
JEDEC Drawing ReferenceNA
J-STD-609 Classificatione8
Table 9-8. 196-Ball TFBGA Package Information
Ball Land0.4 ± 0.05 mm
Nominal Ball Diameter0.35 mm
Solder Mask Opening0.30 ± 0.03 mm
Solder Mask DefinitionSMD
SolderSAC105