9.2 196-Ball TFBGA
Moisture Sensitivity Level | 3 |
Device | Weight (mg) |
---|---|
SAM9X60D6K | 251 |
JEDEC Drawing Reference | NA |
J-STD-609 Classification | e8 |
Ball Land | 0.4 ± 0.05 mm |
Nominal Ball Diameter | 0.35 mm |
Solder Mask Opening | 0.30 ± 0.03 mm |
Solder Mask Definition | SMD |
Solder | SAC105 |