9.1 233-Ball TFBGA

Table 9-1. 233-Ball TFBGA Package Characteristics
Moisture Sensitivity Level3
Table 9-2. Device and 233-Ball TFBGA Package Weight
Device Weight (mg)
SAM9X60D5M394
SAM9X60D1G399
Table 9-3. Package Reference
JEDEC Drawing ReferenceNA
J-STD-609 Classificatione8
Table 9-4. 233-Ball TFBGA Package Information
Ball Land0.45 ± 0.05 mm
Nominal Ball Diameter0.4 mm
Solder Mask Opening0.35 ± 0.03 mm
Solder Mask DefinitionSMD
SolderSAC105