12 Package Outline Drawings

The ATWILC3000-MR110xA package details are outlined in this section.

Note:
  1. Dimensions are in mm.
  2. Having a 5x5 grid of GND vias solidly connecting the exposed GND paddle of the module to the ground plane on the inner/other layers of the host board is recommended. This will provide a good ground and thermal transfer for the ATWILC3000-MR110xA module.