7.4 Package Thermal Specifications

Note: Thermal parameters are measured or estimated for devices in a multi-layer 2S2P PCB per JESD51.

Table 7-4. LAN8670 Package Thermal Parameters (32-VQFN)
Parameter	Symbol	Value	Units	Notes
Junction-to-Ambient	Θ_JA	43	°C/W	Still air
Junction-to-Top-of-Package	Ψ_JT	0.6	°C/W	Still air
Junction-to-Case	Θ_JC	7.6	°C/W

Table 7-5. LAN8671 Package Thermal Parameters (24-VQFN)
Parameter	Symbol	Value	Units	Notes
Junction-to-Ambient	Θ_JA	54	°C/W	Still air
Junction-to-Top-of-Package	Ψ_JT	0.9	°C/W	Still air
Junction-to-Case	Θ_JC	8.3	°C/W

Table 7-6. LAN8672 Package Thermal Parameters (36-VQFN)
Parameter	Symbol	Value	Units	Notes
Junction-to-Ambient	Θ_JA	35	°C/W	Still air
Junction-to-Top-of-Package	Ψ_JT	0.4	°C/W	Still air
Junction-to-Case	Θ_JC	5.0	°C/W

LAN8670/1/2