43.1 Absolute Maximum Ratings

Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions above the parameters indicated in the operation listings of this specification is not implied.

Table 43-1. Absolute Maximum Ratings
ParameterValue
Ambient temperature under bias (PIC32CX-BZ3)(1)-40°C to +125°C
Ambient temperature under bias (WBZ35x)(1)-40°C to +85°C
Storage temperature-65°C to +150°C
Voltage on VDD/VDDIO with respect to GND-0.3V to +4.0V
Voltage on VDDREG with respect to GND-0.3V to +1.4V
Voltage on VDDCORE with respect to GND-0.3V to +1.32V
Voltage on any digital I/O pin, with respect to GND(3)-0.3V to (VDDIO + 0.3V)
Maximum current out of GND pins200 mA
Maximum current into VDD pins(2)200 mA
Maximum output current sunk by any I/O pin10 mA
Maximum output current sourced by any I/O pin15 mA
Maximum current sunk by all ports120 mA
Maximum current sourced by all ports(2)120 mA
Maximum current sunk/sourced by RF supply pin20 mA
Maximum voltage on RF supply pins with respect to GND 1.4V
Maximum Junction Temperature+135°C
ESD Qualification
Human Body Model (HBM) per JESD22-A114±2000V
Charged Device Model (CDM) (ANSI/ESD STM 5.3.1)…(All pins/Corner pins)±500V
Note:
  1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
  2. Maximum allowable current is a function of the device's maximum power dissipation (see the Thermal Operating Conditions table in the Thermal Specifications from Related Links).