43.1 Absolute Maximum Ratings
Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions above the parameters indicated in the operation listings of this specification is not implied.
Parameter | Value |
---|---|
Ambient temperature under bias (PIC32CX-BZ3)(1) | -40°C to +125°C |
Ambient temperature under bias (WBZ35x)(1) | -40°C to +85°C |
Storage temperature | -65°C to +150°C |
Voltage on VDD/VDDIO with respect to GND | -0.3V to +4.0V |
Voltage on VDDREG with respect to GND | -0.3V to +1.4V |
Voltage on VDDCORE with respect to GND | -0.3V to +1.32V |
Voltage on any digital I/O pin, with respect to GND(3) | -0.3V to (VDDIO + 0.3V) |
Maximum current out of GND pins | 200 mA |
Maximum current into VDD pins(2) | 200 mA |
Maximum output current sunk by any I/O pin | 10 mA |
Maximum output current sourced by any I/O pin | 15 mA |
Maximum current sunk by all ports | 120 mA |
Maximum current sourced by all ports(2) | 120 mA |
Maximum current sunk/sourced by RF supply pin | 20 mA |
Maximum voltage on RF supply pins with respect to GND | 1.4V |
Maximum Junction Temperature | +135°C |
ESD Qualification | |
Human Body Model (HBM) per JESD22-A114 | ±2000V |
Charged Device Model (CDM) (ANSI/ESD STM 5.3.1)…(All pins/Corner pins) | ±500V |
Note:
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