43.4 Thermal Specifications
Rating | Symbol | Min. | Typ | Max. | Unit | |
---|---|---|---|---|---|---|
Industrial Temperature Devices: | ||||||
Operating ambient temperature range | TA | -40 | — | +85 | °C | |
Operating junction temperature range | TJ | -40 | — | +95 | °C | |
Extended Temperature Range: | ||||||
Operating ambient temperature range | TA | -40 | — | +125 | °C | |
Operating junction temperature range | TJ | -40 | — | +135 | °C | |
Power Dissipation: Internal Chip Power Dissipation: PINT = (VDDIOx x (IDD –∑ IOH)) I/O Pin Power Dissipation: PI/O = ∑ (({VDDIO – VOH} x IOH) + ∑ (VOL x IOL)) | PD | PINT + PI/O | W | |||
Maximum allowed power dissipation | PDMAX | (TJ – TA)/ϴJA | W | |||
Note: The WBZ35x
Module supports -40°C to
+85°C.
|
Characteristics | Symbol | Typ | Max. | Unit | |
---|---|---|---|---|---|
Thermal Resistance, 48-pin VQFN (6 mm x 6 mm x 0.9 mm) Package | ϴJA | <18 | — | °C/W | |
Thermal Resistance, 32-pin VQFN (5 mm x 5 mm x 0.9 mm) Package | ϴJA | <18 | — | °C/W | |
Note: The junction-to-ambient thermal resistance,
ϴJA, numbers are achieved by package
simulations.
|