4.7 WBZ35x Module Reflow Profile Information

The WBZ35x Module was assembled using the IPC/JEDEC J-STD-020 standard lead-free reflow profile. The WBZ35x Module can be soldered to the host board using standard leaded or lead-free solder reflow profiles. To avoid damaging the module, adhere to the following recommendations:

• For solder reflow recommendations, refer to the AN233 Solder Reflow Recommendation Application Note (DS00233).
• Do not exceed a peak temperature (TP) of 250°C.
• For specific reflow profile recommendations from the vendor, refer to the Solder Paste Data Sheet.
• Use no-clean flux solder paste.
• Do not wash as moisture can be trapped under the shield.
• Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.