41.3.6 Thermal Characteristics

Table 41-6.
Standard Operating Conditions (unless otherwise stated)
Param No.	Sym.	Characteristic	Typ.	Units	Conditions
TH01	θ_JA	Thermal Resistance Junction to Ambient	70	°C/W	8-pin PDIP package
			95.3	°C/W	8-pin SOIC package
			52.3	°C/W	8-pin DFN package
			77.7	°C/W	14-pin SOIC package
			100	°C/W	14-pin TSSOP package
			62.2	°C/W	20-pin PDIP package
			77.7	°C/W	20-pin SOIC package
			31.1	°C/W	20-pin SSOP package
			43	°C/W	20-pin VQFN 3x3x0.9 mm package
TH02	T_JMAX	Maximum Junction Temperature	150	°C
Note: I_DD is current to run the chip alone without driving any load on the output pins. T_A = Ambient Temperature, T_J = Junction Temperature.