7 Product Identification System

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.


Base Part No:	TA010
Package Option	SS	8-Lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC^® SOIC)
	MW	8-Pad 2 x 3 x 1.0 mm Body, Thermally Enhanced with Wettable Flanks Very Thin Dual Flat no Lead Package (VDFN)
	RB	3-Lead Contact Package 2.5x6.5 mm
Temperature Range	Y	-40℃ to +125℃
I/O Type	CZ	Single-Wire Interface
I/O Type	DA	I²C Interface
Shipping Options	B	Tube
Shipping Options	T	Tape and Reel (size varies by package type)
Product Identifier	VAO	Automotive Product Identifier

Examples:

TA010-SSYCZT-VAO: 8-Lead SOIC, -40℃ to +125℃, Single-Wire, Tape and Reel, 3,300 per Reel.
TA010-SSYCZB-VAO: 8-Lead SOIC, -40℃ to +125℃, Single-Wire, Bulk, 100 Per Tube.
TA010-SSYDAT-VAO: 8-Lead SOIC, -40℃ to +125℃, I²C, Tape and Reel, 3,300 per Reel.
TA010-SSYDAB-VAO: 8-Lead SOIC, -40℃ to +125℃, I²C, Bulk, 100 per Tube.
TA010-MWYCZT-VAO: 8-Pad VDFN, -40℃ to +125℃, Single-Wire, Tape and Reel, 5,000 per Reel.
TA010-MWYDAT-VAO: 8-Pad VDFN, -40℃ to +125℃, I²C, Tape and Reel, 5,000 per Reel.
TA010-RBYCZT-VAO: 3-Lead Contact Package, -40℃ to +125℃, Single-Wire, Tape and Reel, 5,000 per Reel.

Note:

Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option.
Small form-factor packaging options may be available. Please check www.microchip.com/packaging for small-form factor package availability or contact your local Sales Office.

: The UDFN Package has been deprecated for use with the TA010 in favor of the VDFN package with wettable flanks. The board land pattern is identical for both packages. The UDFN package will continue to be supported for existing customers on existing programs.