8 Revision History
Revision B (February 2025)
Note: No changes were made to the actual silicon. Changes are only
to the data sheet.
- Features: Corrected the package size of the UDFN package and added VDFN
- DC Parameters: All I/O Interfaces
- Added input thresholds when in Sleep mode (VILS, VIHS)
- Added θJA for the VDFN package type and updated the SOIC θJA and 3-Lead Contact values
- Package Drawings: Added VDFN package information
- Product Identification System: Product identification is now a separate section and not part of Back Matter. Added VDFN package information.
- Microchip Information: Back Matter simplified per Microchip’s new standard.
Revision A (March 2023)
Original release of the document.